In high-speed signal transmission, Signal Integrity (SI) is critical. Materials such as FEP and expanded ePTFE offer key advantages that make them the preferred choice for high-speed cables:

• Low dielectric constant (Dk) and low dissipation factor (Df): Reduce signal loss and maintain a clear eye diagram.
• Excellent thermal and chemical stability: Suitable for high-temperature environments.
• High processing stability: Enables precise impedance control and consistent pair matching.
  
  

PVC, with higher Dk/Df, cannot support ultra-high-speed applications such as PCIe 5.0 / 6.0 or 800G Ethernet.

Some high-speed connectors (e.g., MCIO) offer backward compatibility, but require matching pin mapping and precise PCB layout.

As connector density increases, routing space becomes more limited. Designing for backward compatibility can increase the risk of mechanical interference and SI degradation, so it must be considered early in the design stage.

For AI GPU systems, we recommend:

• MCIO 16X to 8X×2 (Fanout) Cable
• MCIO 16X to Riser Card

These should be paired with a 100Ω twinax structure, skew adjustment, and SI validation. If the cable length exceeds 500 mm, AEC or AOC is recommended to maintain stability.

We recommend using standardized high-speed interface cables such as:

• MCIO, SFF-TA-1016, SFF-TA-1032
• PCIe Gen5/6 compliant and SI-tested (Eye Diagram, Insertion Loss, Return Loss)

Multiple suppliers, including Amphenol, Molex, JPC Connectivity, and ACES, offer compatible products to support cloud data center deployments.